SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 4. (219TH ECS MEETING)

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034275
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Details

  • Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
  • Subtitle: 219TH ECS Meeting
  • Date/Location: Held 2-4 May 2011, Quebec, Canada.
  • Series: ECS Transactions Volume 35 No.02
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781607682134
  • Pages: 363 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( May 2017 )

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Tab 4

 
  • Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
  • Subtitle: 219TH ECS Meeting
  • Date/Location: Held 2-4 May 2011, Quebec, Canada.
  • Series: ECS Transactions Volume 35 No.02
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781607682134
  • Pages: 363 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( May 2017 )