SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 6. (229TH ECS MEETING)

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032776
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  • Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6
  • Subtitle: 229th ECS Meeting
  • Date/Location: Held 29 May - 2 June 2016, San Diego, California, USA.
  • Series: ECS Transactions Volume 72 No.04
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781623323561
  • Pages: 344 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jan 2017 )

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Tab 4

 
  • Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6
  • Subtitle: 229th ECS Meeting
  • Date/Location: Held 29 May - 2 June 2016, San Diego, California, USA.
  • Series: ECS Transactions Volume 72 No.04
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781623323561
  • Pages: 344 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jan 2017 )