WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 12TH 2015. (IWLPC 2015) INTERCONNECTING WLP, MEMS & 2.5/3D INTEGRATION

WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 12TH 2015. (IWLPC 2015) INTERCONNECTING WLP, MEMS & 2.5/3D INTEGRATION

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032698
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Details

  • Title: 12th Annual International Wafer-Level Packaging Conference (IWLPC 2015)
  • Subtitle: Interconnecting WLP, MEMS & 2.5/3D Integration
  • Date/Location: Held 12-14 October 2015, San Jose, California, USA.
  • ISBN: 9781510833036
  • Pages: 184 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Jan 2017 )

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Tab 4

 
  • Title: 12th Annual International Wafer-Level Packaging Conference (IWLPC 2015)
  • Subtitle: Interconnecting WLP, MEMS & 2.5/3D Integration
  • Date/Location: Held 12-14 October 2015, San Jose, California, USA.
  • ISBN: 9781510833036
  • Pages: 184 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Jan 2017 )