SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 5. (AT THE 227TH ECS MEETING)

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031182

$103.20 - $129.00

Details

Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5
Date/Location: Held 24-28 May 2015, Chicago, Illinois, USA.
Series: ECS Transactions Volume 66 No.04
Editor: Roozeboom, F. et al.
ISBN: 9781623322373
Pages: 326 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Electrochemical Society (ECS)
POD Publisher: Curran Associates, Inc. ( Aug 2016 )

Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5
Date/Location: Held 24-28 May 2015, Chicago, Illinois, USA.
Series: ECS Transactions Volume 66 No.04
Editor: Roozeboom, F. et al.
ISBN: 9781623322373
Pages: 326 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Electrochemical Society (ECS)
POD Publisher: Curran Associates, Inc. ( Aug 2016 )