MICROTECHNOLOGY AND THERMAL PROBLEMS IN ELECTRONICS. 2015. (MICROTHERM' 2015) (AND INTERNATIONAL CONFERENCE ON SMART ENGINEERING OF NEW MATERIALS, SENM'2015)

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030577

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Title: Microtechnology and Thermal Problems in Electronics (MicroTherm'2015) and International Conference on Smart Engineering of New Materials (SENM'2015)
Date/Location: Held 22-25 June 2015, Lodz, Poland.
Series: Journal of Physics: Conference Series Volume 709
Editor: Raj, E. et al.
ISBN: 9781510824201
Pages: 85 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Physics Publishing (IOP)
POD Publisher: Curran Associates, Inc. ( Jun 2016 )

Title: Microtechnology and Thermal Problems in Electronics (MicroTherm'2015) and International Conference on Smart Engineering of New Materials (SENM'2015)
Date/Location: Held 22-25 June 2015, Lodz, Poland.
Series: Journal of Physics: Conference Series Volume 709
Editor: Raj, E. et al.
ISBN: 9781510824201
Pages: 85 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Physics Publishing (IOP)
POD Publisher: Curran Associates, Inc. ( Jun 2016 )