Details
- Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
- Date/Location: Held 11-15 October 2015, Phoenix, Arizona, USA.
- Series: ECS Transactions Volume 69 No.06
- Editor: Kondo, K et al.
- ISBN: 9781623323134
- Pages: 111 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jun 2016 )
Description
Members/Attendees
Tab 4
- Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
- Date/Location: Held 11-15 October 2015, Phoenix, Arizona, USA.
- Series: ECS Transactions Volume 69 No.06
- Editor: Kondo, K et al.
- ISBN: 9781623323134
- Pages: 111 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jun 2016 )