Details
- Title: Semiconductor Wafer Bonding 13: Science, Technology, and Applications
- Date/Location: Held 5-9 October 2014, Cancun, Mexico.
- Series: ECS Transactions Volume 64 No.05
- Editor: Moriceau, H. et al.
- ISBN: 9781607685425
- Pages: 405 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Apr 2016 )
Description
Members/Attendees
Tab 4
- Title: Semiconductor Wafer Bonding 13: Science, Technology, and Applications
- Date/Location: Held 5-9 October 2014, Cancun, Mexico.
- Series: ECS Transactions Volume 64 No.05
- Editor: Moriceau, H. et al.
- ISBN: 9781607685425
- Pages: 405 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Apr 2016 )