MICROELECTRONICS AND PACKAGING. INTERNATIONAL CONFERENCE. 39TH 2015. (IMAPS POLAND 2015)

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029598

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Title: 39th International Microelectronics and Packaging Conference (IMAPS Poland 2015)
Date/Location: Held 20-23 September 2015, Gdansk, Poland.
Series: IOP Conference Series: Materials Science and Engineering Volume 104
Editor: Jasinski, P. et al.
ISBN: 9781510819559
Pages: 287 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Physics Publishing (IOP)
POD Publisher: Curran Associates, Inc. ( Mar 2016 )

Title: 39th International Microelectronics and Packaging Conference (IMAPS Poland 2015)
Date/Location: Held 20-23 September 2015, Gdansk, Poland.
Series: IOP Conference Series: Materials Science and Engineering Volume 104
Editor: Jasinski, P. et al.
ISBN: 9781510819559
Pages: 287 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Physics Publishing (IOP)
POD Publisher: Curran Associates, Inc. ( Mar 2016 )