PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE, AND ELECTRONICS PACKAGING 6. (2014 ECS AND SMEQ JOINT INTERNATIONAL MEETING)

PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE, AND ELECTRONICS PACKAGING 6. (2014 ECS AND SMEQ JOINT INTERNATIONAL MEETING)

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028917
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Details

  • Title: Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
  • Date/Location: Held 5-9 October 2014, Cancun, Mexico.
  • Series: ECS Transactions Volume 64 No.40
  • Editor: Kondo, K. et al.
  • ISBN: 9781623322632
  • Pages: 132 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jan 2016 )

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  • Title: Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
  • Date/Location: Held 5-9 October 2014, Cancun, Mexico.
  • Series: ECS Transactions Volume 64 No.40
  • Editor: Kondo, K. et al.
  • ISBN: 9781623322632
  • Pages: 132 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jan 2016 )