WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 11TH 2014. (IWLPC 2014)

WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 11TH 2014. (IWLPC 2014)

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026268
Our Price: $160.00
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Details

  • Title: 11th Annual International Wafer-Level Packaging Conference (IWLPC 2014)
  • Date/Location: Held 11-13 November 2014, San Jose, California, USA.
  • ISBN: 9781510803565
  • Pages: 340 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Jul 2015 )

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Tab 4

 
  • Title: 11th Annual International Wafer-Level Packaging Conference (IWLPC 2014)
  • Date/Location: Held 11-13 November 2014, San Jose, California, USA.
  • ISBN: 9781510803565
  • Pages: 340 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Jul 2015 )