Details
- Title: 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2014)
- Date/Location: Held 9-11 September 2014, Yokohama, Japan.
- IEEE #: CFP14SSD-POD
- ISBN: 9781479952892
- Pages: 372 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2014 )
Description
Members/Attendees
Tab 4
- Title: 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2014)
- Date/Location: Held 9-11 September 2014, Yokohama, Japan.
- IEEE #: CFP14SSD-POD
- ISBN: 9781479952892
- Pages: 372 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2014 )