STRESS INDUCED PHENOMENA AND RELIABILITY IN 3D MICROELECTRONICS. INTERNATIONAL WORKSHOP. 12TH 2012.

STRESS INDUCED PHENOMENA AND RELIABILITY IN 3D MICROELECTRONICS. INTERNATIONAL WORKSHOP. 12TH 2012.

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  • Title: Stress Induced Phenomena and Reliability in 3D Microelectronics 2012
  • Date/Location: Held 28-30 May 2012, Kyoto, Japan.
  • Series: AIP Conference Proceedings Volume 1601
  • Editor: Ho, P. S.
  • ISBN: 9781632667410
  • Pages: 185 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Institute of Physics (AIP)
  • POD Publisher: Curran Associates, Inc. ( Jul 2014 )

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  • Title: Stress Induced Phenomena and Reliability in 3D Microelectronics 2012
  • Date/Location: Held 28-30 May 2012, Kyoto, Japan.
  • Series: AIP Conference Proceedings Volume 1601
  • Editor: Ho, P. S.
  • ISBN: 9781632667410
  • Pages: 185 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Institute of Physics (AIP)
  • POD Publisher: Curran Associates, Inc. ( Jul 2014 )