ELECTRONIC ENGINEERING AND COMPUTER SCIENCE. INTERNATIONAL CONFERENCE. 2013. (EECS 2013)

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021991
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Details

  • Title: 2013 International Conference on Electronic Engineering and Computer Science (EECS 2013)
  • Date/Location: Held 22-23 May 2013, Beijing, China.
  • Series: IERI Procedia Volume 4
  • Editor: Lee, G.
  • ISBN: 9781632663535
  • Pages: 424 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Elsevier Procedia
  • POD Publisher: Curran Associates, Inc. ( Jun 2014 )

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Tab 4

 
  • Title: 2013 International Conference on Electronic Engineering and Computer Science (EECS 2013)
  • Date/Location: Held 22-23 May 2013, Beijing, China.
  • Series: IERI Procedia Volume 4
  • Editor: Lee, G.
  • ISBN: 9781632663535
  • Pages: 424 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Elsevier Procedia
  • POD Publisher: Curran Associates, Inc. ( Jun 2014 )