Skip to main content
ELECTRONIC ENGINEERING AND COMPUTER SCIENCE. INTERNATIONAL CONFERENCE. 2013. (EECS 2013)
- Item #:
- 021991
- UPC:
Details
-
Title:
2013 International Conference on Electronic Engineering and Computer Science (EECS 2013)
-
Date/Location:
Held 22-23 May 2013, Beijing, China.
-
Series:
IERI Procedia Volume 4
-
Editor:
Lee, G.
-
ISBN:
9781632663535
-
Pages:
424 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Elsevier Procedia
-
POD Publisher:
Curran Associates, Inc. ( Jun 2014 )
-
Title:
2013 International Conference on Electronic Engineering and Computer Science (EECS 2013)
-
Date/Location:
Held 22-23 May 2013, Beijing, China.
-
Series:
IERI Procedia Volume 4
-
Editor:
Lee, G.
-
ISBN:
9781632663535
-
Pages:
424 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Elsevier Procedia
-
POD Publisher:
Curran Associates, Inc. ( Jun 2014 )