Details
- Title: 2013 14th International Conference on Electronic Packaging Technology (ICEPT 2013)
- Date/Location: Held 11-14 August 2013, Dalian, China.
- IEEE #: CFP13553-POD
- ISBN: 9781479904990
- Pages: 1,311 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 14th International Conference on Electronic Packaging Technology (ICEPT 2013)
- Date/Location: Held 11-14 August 2013, Dalian, China.
- IEEE #: CFP13553-POD
- ISBN: 9781479904990
- Pages: 1,311 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2014 )