Details
- Title: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2013)
- Date/Location: Held 22-25 October 2013, Taipei, Taiwan.
- IEEE #: CFP1359B-POD
- ISBN: 9781479906666
- Pages: 359 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2013)
- Date/Location: Held 22-25 October 2013, Taipei, Taiwan.
- IEEE #: CFP1359B-POD
- ISBN: 9781479906666
- Pages: 359 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2014 )