Details
- Title: 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2013)
- Date/Location: Held 25-27 September 2013, Berlin, Germany.
- IEEE #: CFP13TII-POD
- ISBN: 9781479922734
- Pages: 388 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2013)
- Date/Location: Held 25-27 September 2013, Berlin, Germany.
- IEEE #: CFP13TII-POD
- ISBN: 9781479922734
- Pages: 388 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2014 )