DESIGNCON. 2013. (2 VOLS)

DESIGNCON. 2013. (2 VOLS)

Item #:
018301
Our Price: $195.00
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Details

  • Title: DesignCon 2013
  • Subtitle: Where Chipheads Connect
  • Date/Location: Held 28-31 January 2013, Santa Clara, California, USA.
  • ISBN: 9781627484725
  • Pages: 1,977 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: UBM Electronics
  • POD Publisher: Curran Associates, Inc. ( Aug 2013 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: DesignCon 2013
  • Subtitle: Where Chipheads Connect
  • Date/Location: Held 28-31 January 2013, Santa Clara, California, USA.
  • ISBN: 9781627484725
  • Pages: 1,977 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: UBM Electronics
  • POD Publisher: Curran Associates, Inc. ( Aug 2013 )