INTERCONNECT CHALLENGES FOR CMOS TECHNOLOGY. MATERIALS, PROCESSES AND RELIABILITY FOR DOWNSCALING, PACKAGING AND 3D STACKING (SYMPOSIUM C AT THE 2012 MRS SPRING MEETING)
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Title:Interconnect Challenges for CMOS Technology
Subtitle:Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking (Symposium C at the 2012 MRS Spring Meeting)
Date/Location:Held 9-13 April 2012, San Francisco, California, USA.
Series:Materials Research Society Symposium Proceedings Volume 1428
