KNOWN GOOD DIE. 2012. (CO-LOCATED WITH ROADMAPS FOR MULTI DIE INTEGRATION) REDUCING COSTS THROUGH YIELD OPTIMIZATION

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017474

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Details

Title: Known Good Die 2012
Subtitle: Reducing Costs Through Yield Optimization (Co-located with Roadmaps for Multi Die Integration 2012)
Date/Location: Held 15 November 2012, Santa Clara, California, USA.
Series: MEPTEC Symposium Proceedings Number 52
ISBN: 9781622769612
Pages: 134 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
POD Publisher: Curran Associates, Inc. ( May 2013 )

Title: Known Good Die 2012
Subtitle: Reducing Costs Through Yield Optimization (Co-located with Roadmaps for Multi Die Integration 2012)
Date/Location: Held 15 November 2012, Santa Clara, California, USA.
Series: MEPTEC Symposium Proceedings Number 52
ISBN: 9781622769612
Pages: 134 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
POD Publisher: Curran Associates, Inc. ( May 2013 )