Details
- Title: 2.5D, 3D and Beyond: Bringing 3D Integration to the Packaging Mainstream 2011
- Date/Location: Held 9 November 2011, Santa Clara, California, USA.
- ISBN: 9781618394507
- Pages: 129 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Mar 2012 )
Description
Members/Attendees
Tab 4
- Title: 2.5D, 3D and Beyond: Bringing 3D Integration to the Packaging Mainstream 2011
- Date/Location: Held 9 November 2011, Santa Clara, California, USA.
- ISBN: 9781618394507
- Pages: 129 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Mar 2012 )