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ENABLING 3D: TEMPORARY BONDING WORKSHOP. 2011.
- Item #:
- 013698
- UPC:
Details
-
Title:
Enabling 3D: Temporary Bonding Workshop 2011
-
Date/Location:
Held 11 July 2011, San Francisco, California, USA.
-
ISBN:
9781618393920
-
Pages:
34 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Sematech
-
POD Publisher:
Curran Associates, Inc. ( Mar 2012 )
-
Title:
Enabling 3D: Temporary Bonding Workshop 2011
-
Date/Location:
Held 11 July 2011, San Francisco, California, USA.
-
ISBN:
9781618393920
-
Pages:
34 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Sematech
-
POD Publisher:
Curran Associates, Inc. ( Mar 2012 )