STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: PRODUCT-LEVEL RELIABILITY WORKSHOP. 2011.

STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: PRODUCT-LEVEL RELIABILITY WORKSHOP. 2011.

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013696
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  • Title: Stress Management for 3D ICs Using Through Silicon Vias: Product-Level Reliability Workshop 2011
  • Date/Location: Held 14 July 2011, San Francisco, California, USA.
  • ISBN: 9781618393906
  • Pages: 73 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Mar 2012 )

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  • Title: Stress Management for 3D ICs Using Through Silicon Vias: Product-Level Reliability Workshop 2011
  • Date/Location: Held 14 July 2011, San Francisco, California, USA.
  • ISBN: 9781618393906
  • Pages: 73 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Mar 2012 )