3DS-IC TEMPORARY BONDING TECHNOLOGY WORKSHOP. SEMICON TAIWAN. 2011.

3DS-IC TEMPORARY BONDING TECHNOLOGY WORKSHOP. SEMICON TAIWAN. 2011.

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013695
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Details

  • Title: SEMICON Taiwan 3DS-IC Temporary Bonding Technology Workshop 2011
  • Date/Location: Held 9 September 2011, Hsinchu, Taiwan.
  • ISBN: 9781618393890
  • Pages: 111 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Mar 2012 )

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  • Title: SEMICON Taiwan 3DS-IC Temporary Bonding Technology Workshop 2011
  • Date/Location: Held 9 September 2011, Hsinchu, Taiwan.
  • ISBN: 9781618393890
  • Pages: 111 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Mar 2012 )