ELECTRONIC MATERIALS AND PACKAGING. INTERNATIONAL CONFERENCE. 11TH 2009. (EMAP 2009)

ELECTRONIC MATERIALS AND PACKAGING. INTERNATIONAL CONFERENCE. 11TH 2009. (EMAP 2009)

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011455
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  • Title: 11th International Conference on Electronic Materials and Packaging 2009 (EMAP 2009)
  • Date/Location: Held 1-3 December 2009, Penang, Malaysia.
  • ISBN: 9781617827402
  • Pages: 434 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Intel Technology SDN BHD / Pac Tech SDN BHD
  • POD Publisher: Curran Associates, Inc. ( Jun 2011 )

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  • Title: 11th International Conference on Electronic Materials and Packaging 2009 (EMAP 2009)
  • Date/Location: Held 1-3 December 2009, Penang, Malaysia.
  • ISBN: 9781617827402
  • Pages: 434 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Intel Technology SDN BHD / Pac Tech SDN BHD
  • POD Publisher: Curran Associates, Inc. ( Jun 2011 )