Details
- Title: From Chip to System: Design Challenges and Solutions
- Date/Location: Held 25 February 2010, San Jose, California, USA.
- ISBN: 9781617821882
- Pages: 322 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Apr 2011 )
Description
Members/Attendees
Tab 4
- Title: From Chip to System: Design Challenges and Solutions
- Date/Location: Held 25 February 2010, San Jose, California, USA.
- ISBN: 9781617821882
- Pages: 322 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Apr 2011 )