PACKAGING, CHIP-PACKAGE INTERACTIONS AND SOLDER MATERIALS CHALLENGES. (SYMPOSIUM F AT THE 2009 MRS SPRING MEETING)

PACKAGING, CHIP-PACKAGE INTERACTIONS AND SOLDER MATERIALS CHALLENGES. (SYMPOSIUM F AT THE 2009 MRS SPRING MEETING)

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  • Title: Packaging, Chip-Package Interactions and Solder Materials Challenges
  • Subtitle: Symposium F at the 2009 MRS Spring Meeting
  • Date/Location: Held 13-17 April 2009, San Francisco, California, USA.
  • Series: Materials Research Society Symposium Proceedings Volume 1158
  • ISBN: 9781615677788
  • Pages: 84 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Springer Nature (SNCSC)
  • POD Publisher: Curran Associates, Inc. ( Feb 2010 )

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  • Title: Packaging, Chip-Package Interactions and Solder Materials Challenges
  • Subtitle: Symposium F at the 2009 MRS Spring Meeting
  • Date/Location: Held 13-17 April 2009, San Francisco, California, USA.
  • Series: Materials Research Society Symposium Proceedings Volume 1158
  • ISBN: 9781615677788
  • Pages: 84 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Springer Nature (SNCSC)
  • POD Publisher: Curran Associates, Inc. ( Feb 2010 )