PACKAGING, CHIP-PACKAGE INTERACTIONS AND SOLDER MATERIALS CHALLENGES. (SYMPOSIUM F AT THE 2009 MRS SPRING MEETING)

Item #:

006936

Our Price: $65.00

Details

Title: Packaging, Chip-Package Interactions and Solder Materials Challenges
Subtitle: Symposium F at the 2009 MRS Spring Meeting
Date/Location: Held 13-17 April 2009, San Francisco, California, USA.
Series: Materials Research Society Symposium Proceedings Volume 1158
ISBN: 9781615677788
Pages: 84 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Cambridge University Press (CUP) / Materials Research Society (MRS)
POD Publisher: Curran Associates, Inc. ( Feb 2010 )

Title: Packaging, Chip-Package Interactions and Solder Materials Challenges
Subtitle: Symposium F at the 2009 MRS Spring Meeting
Date/Location: Held 13-17 April 2009, San Francisco, California, USA.
Series: Materials Research Society Symposium Proceedings Volume 1158
ISBN: 9781615677788
Pages: 84 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Cambridge University Press (CUP) / Materials Research Society (MRS)
POD Publisher: Curran Associates, Inc. ( Feb 2010 )