Details
- Title: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Inter-Level Dielectrics
- Subtitle: Held at the 214th ECS Meeting
- Date/Location: Held 12-17 October 2008, Honolulu, Hawaii.
- Series: ECS Transactions Volume 16 No.19
- Editor: Mathad, G.
- ISBN: 9781615672936
- Pages: 61 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2009 )
Description
Members/Attendees
Tab 4
- Title: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Inter-Level Dielectrics
- Subtitle: Held at the 214th ECS Meeting
- Date/Location: Held 12-17 October 2008, Honolulu, Hawaii.
- Series: ECS Transactions Volume 16 No.19
- Editor: Mathad, G.
- ISBN: 9781615672936
- Pages: 61 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2009 )