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MATERIALS AND HYPERINTEGRATION CHALLENGES IN NEXT-GENERATION INTERCONNECT TECHNOLOGY. (SYMPOSIUM M AT THE 2007 MRS FALL MEETING)
- Item #:
- 004891
- UPC:
Details
-
Title:
Materials and Hyperintegration Challenges in Next-Generation Interconnect Technology
-
Subtitle:
Symposium M at the 2007 MRS Fall Meeting
-
Date/Location:
Held 26-30 November 2007, Boston, Massachusetts.
-
Series:
Materials Research Society Symposium Proceedings Volume 1036
-
ISBN:
9781605608334
-
Pages:
48 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Cambridge University Press (CUP) / Materials Research Society (MRS)
-
POD Publisher:
Curran Associates, Inc. ( Apr 2009 )
-
Title:
Materials and Hyperintegration Challenges in Next-Generation Interconnect Technology
-
Subtitle:
Symposium M at the 2007 MRS Fall Meeting
-
Date/Location:
Held 26-30 November 2007, Boston, Massachusetts.
-
Series:
Materials Research Society Symposium Proceedings Volume 1036
-
ISBN:
9781605608334
-
Pages:
48 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Cambridge University Press (CUP) / Materials Research Society (MRS)
-
POD Publisher:
Curran Associates, Inc. ( Apr 2009 )
