Details
- Title: The 2008 International Conference on Embedded Software and Systems Symposia (ICESS Symposia 2008)
- Date/Location: Held 29-31 July 2008, Chengdu, Sichuan, China.
- IEEE #: CFP0847E-POD
- ISBN: 9780769532882
- Pages: 518 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2009 )
Description
Members/Attendees
Tab 4
- Title: The 2008 International Conference on Embedded Software and Systems Symposia (ICESS Symposia 2008)
- Date/Location: Held 29-31 July 2008, Chengdu, Sichuan, China.
- IEEE #: CFP0847E-POD
- ISBN: 9780769532882
- Pages: 518 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2009 )