THIN FILM MATERIALS, PROCESSES, AND RELIABILITY. (AT 211TH ECS MEETING)

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002132
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  • Title: Thin Film Materials, Processes, and Reliability
  • Subtitle: Held at the 211th ECS Meeting
  • Date/Location: Held 6-11 May 2007, Chicago, Illinois.
  • Series: ECS Transactions Volume 6 No.12
  • Editor: Mathad, G.
  • ISBN: 9781604238884
  • Pages: 59 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jan 2008 )

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  • Title: Thin Film Materials, Processes, and Reliability
  • Subtitle: Held at the 211th ECS Meeting
  • Date/Location: Held 6-11 May 2007, Chicago, Illinois.
  • Series: ECS Transactions Volume 6 No.12
  • Editor: Mathad, G.
  • ISBN: 9781604238884
  • Pages: 59 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Jan 2008 )