WAFER BONDING AND THINNING TECHNIQUES FOR MATERIALS INTEGRATION. (SYMPOSIUM I AT THE 2001 MRS SPRING MEETING)

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000297

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Title: Wafer Bonding and Thinning Techniques for Materials Integration
Subtitle: Symposium I at the 2001 MRS Spring Meeting
Date/Location: Held 16-20 April 2001, San Francisco, California, USA.
Series: Materials Research Society Symposium Proceedings Volume 681
ISBN: 9781558996175
Pages: 200 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Cambridge University Press (CUP) / Materials Research Society (MRS)
POD Publisher: Curran Associates, Inc. ( Oct 2006 )

Title: Wafer Bonding and Thinning Techniques for Materials Integration
Subtitle: Symposium I at the 2001 MRS Spring Meeting
Date/Location: Held 16-20 April 2001, San Francisco, California, USA.
Series: Materials Research Society Symposium Proceedings Volume 681
ISBN: 9781558996175
Pages: 200 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Cambridge University Press (CUP) / Materials Research Society (MRS)
POD Publisher: Curran Associates, Inc. ( Oct 2006 )