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WAFER BONDING AND THINNING TECHNIQUES FOR MATERIALS INTEGRATION. (SYMPOSIUM I AT THE 2001 MRS SPRING MEETING)
- Item #:
- 000297
- UPC:
Details
-
Title:
Wafer Bonding and Thinning Techniques for Materials Integration
-
Subtitle:
Symposium I at the 2001 MRS Spring Meeting
-
Date/Location:
Held 16-20 April 2001, San Francisco, California, USA.
-
Series:
Materials Research Society Symposium Proceedings Volume 681
-
ISBN:
9781558996175
-
Pages:
200 (1 Vol)
-
Format:
Softcover
-
Publisher:
Springer Nature (SNCSC)
-
POD Publisher:
Curran Associates, Inc. ( Oct 2006 )
-
Title:
Wafer Bonding and Thinning Techniques for Materials Integration
-
Subtitle:
Symposium I at the 2001 MRS Spring Meeting
-
Date/Location:
Held 16-20 April 2001, San Francisco, California, USA.
-
Series:
Materials Research Society Symposium Proceedings Volume 681
-
ISBN:
9781558996175
-
Pages:
200 (1 Vol)
-
Format:
Softcover
-
Publisher:
Springer Nature (SNCSC)
-
POD Publisher:
Curran Associates, Inc. ( Oct 2006 )
