Details
- Title: 2019 5th International Conference on Big Data and Information Analytics (BigDIA 2019)
- Date/Location: Held 8-10 July 2019, Kunming, China.
- IEEE #: CFP19Q65-POD
- ISBN: 9781728139340
- Pages: 184 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 5th International Conference on Big Data and Information Analytics (BigDIA 2019)
- Date/Location: Held 8-10 July 2019, Kunming, China.
- IEEE #: CFP19Q65-POD
- ISBN: 9781728139340
- Pages: 184 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )