Details
- Title: 2018 IEEE 23rd International Conference on Digital Signal Processing (DSP 2018)
- Date/Location: Held 19-21 November 2018, Shanghai, China.
- IEEE #: CFP18452-POD
- ISBN: 9781538668122
- Pages: 1,290 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE 23rd International Conference on Digital Signal Processing (DSP 2018)
- Date/Location: Held 19-21 November 2018, Shanghai, China.
- IEEE #: CFP18452-POD
- ISBN: 9781538668122
- Pages: 1,290 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )