Details
- Title: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018)
- Date/Location: Held 26-28 September 2018, Stockholm, Sweden.
- IEEE #: CFP18TII-POD
- ISBN: 9781538667606
- Pages: 328 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018)
- Date/Location: Held 26-28 September 2018, Stockholm, Sweden.
- IEEE #: CFP18TII-POD
- ISBN: 9781538667606
- Pages: 328 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )