Details
- Title: 2018 IEEE XXV International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2018)
- Date/Location: Held 8-10 August 2018, Lima, Peru.
- IEEE #: CFP18D62-POD
- ISBN: 9781538654927
- Pages: 413 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE XXV International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2018)
- Date/Location: Held 8-10 August 2018, Lima, Peru.
- IEEE #: CFP18D62-POD
- ISBN: 9781538654927
- Pages: 413 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )